[ ] - Indicates a premium service
| Industry Standards |
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UL 94V-0 flammability rating |
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IPC 600, 6011, 6012 Class 2 & 3 |
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ISO 9001-2000 |
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RoHS Compliant |
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| Materials |
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Laminate & Prepreg per IPC4101 & IPC-CF-150E |
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FR4 (standard & 170 C Tg) |
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Rogers, Nelco, Isola, Taconic, Polyimide |
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Rigid-Flex PCB, Metal PCB, Teflon PCB |
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| Construction |
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Max number of layers: |
10 [24+] |
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Min finished board thickness: |
0.020" [0.008"] |
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Max finished board thickness: |
0.125" [0.300"] |
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Minimum core thickness: |
0.005" [0.002"] |
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Minimum dielectric thickness: |
0.005" [0.002"] |
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Maximum aspect ratio: |
10:1 [30:1] |
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Thickness tolerance: |
10% [7%] |
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Layer registration tolerance: |
0.005" [0.003"] |
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Maximum Warpage: |
0.007" [0.006"] |
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Min conductor to edge space: |
0.015" [0.008"] |
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| Fabrication |
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Overall dimension tolerance : |
0.008" [0.005"] |
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Cutout tolerance: |
0.008" [0.005"] |
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Minimum inside radius: 0.015" |
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Route-and retain (tab routing) |
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V-Scoring (single and double-edged) |
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Countersink & counter bore |
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Beveling & edge milling |
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Finger & slot routing |
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Jump scoring |
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| Line & Space |
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Minimum outer layer trace width: |
0.005" [0.003"] |
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Minimum outer layer space: |
0.005" [0.003"] |
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Minimum inner layer trace width: |
0.005" [0.003"] |
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Minimum inner layer space: |
0.005" [0.003"] |
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Finished trace width within 20% of artwork |
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| Impedence |
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Tolerance (25-100 ohms): |
10% [5%] |
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Controlled impedance dielectric |
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Impedance-controlled lines |
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Differential/single-ended impedence controll |
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| Drilling |
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Minimum hole size: |
0.005" [0.004"] |
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Min pad size over hole: |
0.012" [0.008"] |
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Hole size tolerance: |
0.003" [0.002"] |
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Hole location tolerance: +/- 0.003" |
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Blind/buried vias, tented vias, via plugs |
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Via-In-Pad (BGA/MBGA) |
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Countersinks, plated & non-plated slots |
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| Copper Plating |
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Minimum base copper: |
1/2 oz. [1/4 oz.] |
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Maximum base copper: |
2 oz. [10 oz.] |
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Minimum copper foil: |
1/2 oz. [1/8 oz.] |
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Maximum copper foil: |
2 oz. [10 oz.] |
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Hole plating thickness: 0.0007" - 0.005" |
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| Surface Finishes |
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HASL (Hot Air Solder Leveled) |
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HAL (Lead-Free Solder) |
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ENIG (Electroless Nickel, Immersion Gold) |
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Hard Gold (full body or selective) |
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Soft Gold (full body or selective) |
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Immersion Silver / Nickel / Tin / Palladium |
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Gold plated fingers/edge connectors |
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OSP (Organic Solderability Preservative) |
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Combination Finishes |
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| Solder Mask / Silkscreen |
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Liquid photoimageable solder mask |
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Solder mask colors available: full spectrum |
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Solder mask registration tolerance: +/-0.005" |
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Minimum solder mask web: 0.002" |
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Solder mask nominal thickness: 0.0004" |
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Conductive and non-conductive via fill |
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Silkscreen min 0.007" line required |
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Silkscreen colors available: full spectrum |
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| Electrical Testing |
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Continuity 10-50 ohm (50 ohm std.) |
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Isolation 10-100 Mohm (10 Mohm std.) |
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Voltage 10-250V (100 V std.) |
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Net list comparison |
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Flying probe testing |
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HiPot testing up to 1200 volts |
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| Turn Times |
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Standard turn for 2/4 layer board: 7 Days |
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Expedite turn for 2/4 layer board: 5 Days |
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Standard turn for 6+ layer board: 10 Days |
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Expedite turn for 6+ layer board: 7 Days |
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